ProActiv helps manufacturers rise to the challenges of increasing miniaturisation and higher board densities. This breakthrough process technology from DEK enables next generation components to be printed alongside standard components, using only a conventional printing process with a single thickness stencil.
While there are many factors in a stencil printing process, it is the stencil aperture area ratio that fundamentally dictates what can or cannot be printed. As stencil aperture ratios decrease to address component miniaturisation and heterogeneous assemblies, the chance of successful printing falls. While existing area ratio process rules limit conventional printing with smaller apertures, ProActiv breaks through and redefines these rules.
A revolutionary printing technology, ProActiv extends the print process window to a level that enables consistent printing of small apertures for 0.3mm CSPs and 01005 passives. When activated, ProActiv energises the solder paste in contact with the squeegee blade. It’s a unique action known as ‘shear thinning’ that instantly makes the paste more compliant without altering its composition. This process increases the aperture fill to transform solder paste transfer efficiency, delivering immediate improvements in quality, yield and throughput – even with today’s subassemblies.
ProActiv offers a robust and stable process that significantly increases yield to reduce rework and scrap. It also reduces stencil cleaning frequency to increase throughput, and improves stencil and squeegee blade life through less squeegee blade to stencil friction. The result is dramatically lower production costs and unprecedented paste transfer efficiency.