Processing chip packages one at a time is costly due to the slow throughput. To overcome this, the industry usually uses a JEDEC boat "dedicated carrier" to process ten or more at a time, usually with a solder paste dispensing unit. Virtual Panel Tooling (VPT) enables a stencil printer to be used. The VPT technology enables packages to be soldered and ready for component placement in a much shorter cycle time, substantially reducing the cost per package. Further more, stencil printing solder is a more robust and stable process than dispensing. The common defect for dispensing solder is missing dots due to clogged nozzles.

The process enables the conveyorised transport and processing of individual substrates of a wide variety of sizes, one at a time. Each tooling plate is custom made to precise specifications and provides the perfect platform for processes that include but are not limited to flux / solder paste printing or solder sphere placement.

• Process multiple, singulated substrates in a single, rapid cycle
• High throughput comparable to processing panelised substrates
• Accuracy comparable to individually aligning each substrate before processing
• Ideal for substrate bumping
• Compatible with solder paste printing or solder ball placement processes
• Outstanding yield at the speed you need to meet the toughest production schedules
• Print Technique: Standard SMT technique
• Stencil: Standard SMT stencils with underside relief for the C4 area. The actual number of components possible per cycle will be determined by the dimensions of the package and what can fit within the JEDEC boat
• Key Parameters: Print strokes, print speed, paste pressure, system pressure, separation speed
• Line Configuration: Loader - DEK ELA / HorizoniX / Infinity - Pick & Place - Reflow. It is possible to have a flux printer in line ahead of the solder printer so the die attach application can be included in this one line
• Hardware: Standard DEK printer with the VPT option specific to the package dimensions installed. ProFlow® is the desired method, but squeegees will also work
• Tooling: A VPT unit with top plate and a surround plate specific to the package dimensions. Also snugging rails and remote board stop options are required
• Under Screen Cleaner: Standard Blue or Vortex units
• Software: Standard software is used at this time
• Clean Room Classification: This is not a clean room application
• Other Applications: The VPT solution enables many applications within the packaging industry including flux printing and thermal material printing for heat spreader attachment. Any Dispensing application is a candidate for VPT solutions

The following is an example of a typical Site Implementation Plan:

Foundation
Present the product
Feasibility study
Benchmark current process
Set goals and objectives
Establish project team
Milestone review

Preparation
Critical success factors
Lab test
Define induction and education plan
Milestone review

Implementation
Functionality
Robustness
Pre-production
Milestone review

Introduction to high volume
Roll out
Site-wide induction and education
Sign off

Audit
Three months
Five months
One year

See also:

Virtual Panel Tooling