The DEK Wafer Handling Station is a fully automated handling solution, integrated with DEK's wafer level mass imaging processes. It is developed in conjunction with Adept Semiconductor Equipment Division; a specialist partner with impeccable credentials. This handling solution allows you to process wafers up to 200mm from standard, open cassettes with no adjustment necessary. The handling portfolio also includes a turnkey solution for 300mm wafers.
This wafer handling capability is compliant with SMEMA and SEMI S-2 industry standards, and perfectly integrated with our mass imaging technology and processes. Each wafer is unloaded from the cassette onto the wafer chuck for mass imaging. After processing, the wafer can be returned to its original position in the cassette or transferred directly to a reflow oven for in line configuration. Comprehensive features include multi-position loading for up to 6 cassettes, pre-alignment to ± 0.5µm accuracy, windows-based control interfaces and optional Class 1, 10, 100 clean air source.
The single point utility and controls interface features a Windows-based GUI for intuitive, offline development and optimisation of your process flow. Savings in paste wastage deliver further cost reductions in a process that is already significantly less expensive than first generation approaches to wafer bumping.