Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced technological capabilities that are essential for emerging packaging technologies and assembly challenges. Equipped to handle a range of high accuracy applications at wafer, substrate and board level, Galaxy is ideal for complex packages such as flip-chips, uBGAs and ultra fine pitch SMT.

Delivering unprecedented flexibility; Galaxy’s immense capability and broad compatibility, combined with fast changeover, create a process-agnostic platform capable of rapid reassignment as business demands dictate. DirEKt Ball Attach to wafers or substrates, at ball diameters down to 0.2mm; wafer bumping by solder paste printing; SMT pre-placement for next generation assemblies including "silicon dust" components: deploy – and re-deploy – at will.

Standalone, or as part of a turnkey process configured by DEK specialists, Galaxy is the ultimate performer.

• Process alignment capability 2 Cpk @ ± 12.5µm 6-Sigma
• Machine alignment capability 2 Cpk @ ± 12.5µm 6-Sigma
• 7 seconds cycle time
• Product changeover – 2 mins
• New product set-up - under 10 mins
• Remote operation, monitoring and diagnostics
• DEK Instinctiv V9™-equipped: TTG, on-board help and error recovery
• Direct interface with DEK wafer loader, fluxing station
• SMEMA-compliant output interface to downstream placement/grid array reflow
• Linear motor technology for ultimate speed and accuracy

• High accuracy applications at wafer, substrate and board level
• True remote operation, operating at the pinnacle for extended periods with only minimal, cost-effective maintenance and adjustment
• Instinctiv™ V9 software enables faster setup and first time print, lower operator training requirements, easier error avoidance and recovery
• Advanced mechanical features including linear motor technology enhance speed, accuracy and reliability
• Standard tooling bed accepts all compatible tooling options including Virtual Panel Tooling for arrayed singulated substrates
• Fast changeover for rapid reassignment as business demands dictate
• ProFlow® DirEKt Imaging technology enables predictable, repeatable ball placement for solder balls as small as 0.2mm for first pass yields above 99.9%
• Advanced optics and lighting for faultless optical inspection at high-throughput
• SMEMA-compatible interfaces support easy integration with DEK wafer loading and substrate fluxing solutions, as well as back-end equipment

Downloads:

Brochure

Technical Specification  

Galaxy - Footprint (DXF)

Galaxy - Footprint (PDF)

Galaxy HTC - Footprint (DXF)

Galaxy HTC - Footprint (PDF)

Press Releases:
DEK Galaxy Platform Enables LORD Corporation’s Product Development Initiatives

Galaxy Thin Wafer System from DEK Enhances Process Capability for HVM Thinned Wafer Applications