Galaxy unites advanced semiconductor packaging and high precision next-generation SMT assembly on the same platform. This level of convergence delivers the advanced technological capabilities that are essential for emerging packaging technologies and assembly challenges. Equipped to handle a range of high accuracy applications at wafer, substrate and board level, Galaxy is ideal for complex packages such as flip-chips, uBGAs and ultra fine pitch SMT.
Delivering unprecedented flexibility; Galaxy’s immense capability and broad compatibility, combined with fast changeover, create a process-agnostic platform capable of rapid reassignment as business demands dictate. DirEKt Ball Attach to wafers or substrates, at ball diameters down to 0.2mm; wafer bumping by solder paste printing; SMT pre-placement for next generation assemblies including "silicon dust" components: deploy – and re-deploy – at will.
Standalone, or as part of a turnkey process configured by DEK specialists, Galaxy is the ultimate performer.