Virtual Panel Tooling provides just that: dozens of substrates are independently aligned, simultaneously, creating a virtual panel ready for imaging in a single cycle. This concept delivers high throughput comparable to processing panelised substrates, but with accuracy comparable to individually aligning each substrate before processing. Singulated substrates are loaded into a standard JEDEC carrier, and enter the machine simultaneously.
Specialised DEK Virtual Panel Tooling carriers are also available. Each substrate is then aligned independently by adjusting in x, y and _. They are then locked by vacuum and a surround applied to create a virtual panel. The imaging process is then completed in a single pass, creating multiple, highly accurate processed substrates at high speed.
Virtual Panel Tooling is ideal for substrate bumping, and is compatible with solder paste printing or solder ball placement processes. You can print epoxies for die attach, conductive adhesives for a number of applications; even replace dispensing processes to gain a valuable throughput advantage without compromising precision. It is also suitable for pick and place processes. The result: outstanding yield at the speed you need to meet the toughest production schedules.