DEK International - Articles DEK are happy to produce this RSS feed which can be read in many freely available RSS Readers http://www.dek.com Mon, 11 Jul 2005 01:25:48 PM +0100 Mass imaging responds to future packaging challengeThu, 15 Dec 2005 11:04:17 +0100Today’s chip scale technologies are challenging everyone involved in producing advanced semiconductor packages in high volumes and at low cost for mass market applications. http://www.dek.com/comms.nsf/PR/3935121A4E80E8D880256FF80042CB2C!opendocumentCrossing the Bridge from Dispensing to Mass Imaging Thu, 15 Dec 2005 11:04:26 +0100Traditionally, equipment and process development have been pigeonholed into their respective fields of expertise, requirements and categories.http://www.dek.com/comms.nsf/PR/2D39EB64CB17211E80256FF80044FCD6!opendocumentScreen Printing Redefined: How High Accuracy Mass Imaging is Revolutionizing Traditional DispensingThu, 15 Dec 2005 11:04:27 +0100Traditional dispensing is a serial process and, as each machine approaches its speed limit, the only solution for improving throughput is to add more dispensers. http://www.dek.com/comms.nsf/PR/A59BEFC0CB8E237B802570930039FA49!opendocumentFurther Investigation into Lead (Pb)-Free Assembly: Stencil Technologies for Mass Imaging Thu, 15 Dec 2005 11:04:29 +0100As electronic assemblers prepare for the lead (Pb)-free era officially beginning July 2006, it is becoming clear that a comprehensive re-evaluation of assembly processes from screen printing onwards is requiredhttp://www.dek.com/comms.nsf/PR/E7C2D02AE83448B280257093004139A6!opendocumentThink Your Printing Process Won’t Be Affected by Lead-Free?Thu, 15 Dec 2005 11:04:30 +0100As the industry prepares for the shift to lead-free manufacturing, there have been numerous workshops, conferences and technical sessions on the subject.http://www.dek.com/comms.nsf/PR/FBD707783C7B27D98025709600405B06!opendocumentMass Imaging in Next Generation Via Filling ProcessesThu, 15 Dec 2005 11:04:31 +0100Growing reliance on filled vias, particularly the emerging via in pad technology that demands sub-mm diameter bores, means PCB fabricators now need to automate via filling processes to achieve the necessary throughput and repeatability improvements.http://www.dek.com/comms.nsf/PR/17ADA260C9F0373A802570960040DB45!opendocumentConsumer demands require technological responseThu, 15 Dec 2005 11:04:32 +0100Among the many techniques that must come together to satisfy these demands, board-level interconnect pitch has always lagged behind the dimensions encountered at wafer level, and thereby slowed the pace of miniaturisation.http://www.dek.com/comms.nsf/PR/D17C35044B8818328025709600423D8E!opendocumentHigh Accuracy Mass Imaging Responds to Wafer-Scale Packaging AdvancesThu, 15 Dec 2005 11:04:34 +0100Packaging overheads are low, leading to highly miniaturized components, and electrical performance is also enhanced. These are ideal attributes for broadband applications such as IP-based voice and data communications, Gigabit and 10G Ethernet, and 3G mobile. SiP, on the other hand, offers a potentially more flexible, lower cost alternative to the System on Chip, more tolerant of redesign and inherently able to support mixed technologies.http://www.dek.com/comms.nsf/PR/7D93397C22DE03AB80257096004BBAF8!opendocumentBeyond Assembly: Alternative Applications for High-Accuracy Mass ImagingThu, 15 Dec 2005 11:04:35 +0100Because high-accuracy mass imaging is not a serial process, it offers compelling economic advantages in a wide variety of medium and high volume assembly and packaging applications, especially ones that have traditionally been done using dispensing techniques.http://www.dek.com/comms.nsf/PR/692F2F62EB590375802570960053C102!opendocumentMass Imaging PrevailsThu, 15 Dec 2005 11:04:36 +0100Dispensing has long been regarded in the electronics industry as the optimum solution to the challenge of precision material deposition. The versatility of the technique, combined with its ability to be reprogrammed, has previously met the requirements of manufacturers around the world.http://www.dek.com/comms.nsf/PR/27F19CC389BB410A8025709600544612!opendocumentMass Imaging of Lead Free Materials - What impact does Stencil Technology have?Thu, 15 Dec 2005 11:04:37 +0100The component and PCB industries believe they are ready for the new age. But assemblers now need hands-on experience, particularly at pre-placement, if they are to implement workable processes in time for Waste in Electrical and Electronic Equipment (WEEE).http://www.dek.com/comms.nsf/PR/7F3CA0B6085A7D4F802570A1003B3317!opendocumentIndustry View – Interview with Rich Heimsch, President of DEK InternationalThu, 15 Dec 2005 11:04:38 +0100http://www.dek.com/comms.nsf/PR/F137E2A59FEDFF8D802570A10045A1E8!opendocumentThe State of Stencil Technology Today — And To ComeThu, 15 Dec 2005 11:04:39 +0100In surface mount assembly, the stencil is the gateway to accurate and repeatable solder paste deposition.http://www.dek.com/comms.nsf/PR/94788F195EB5B38A802570A100463176!opendocumentInspection versus Quality; High-Speed Verification and the New Third WayMon, 13 Feb 2006 16:36:06 +0100Quality cannot be “inspected-in” to processes or products, urged W. Edwards Deming in his fourteen rules for manufacturing. Deming’s ideas, formed in immediate post-war Japan, have informed debate about the role of inspection throughout the entire modern era of electronic manufacturing.http://www.dek.com/comms.nsf/PR/F013E6DE279C3F8D80257110004CE85D!opendocument