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Singulation
Processing Chip packages one at a time is costly due to the slow throughput. To overcome this, the industry usually uses a JEDEC boat "dedicated carrier" to process 10 or more at a time, usually with a solder paste dispensing unit. Virtual Panel Tooling (VPT) enables a Stencil printer to be used. The VPT technology enables packages to be soldered and ready for component placement in a much shorter cycle time severely reducing the cost per package. Further more, stencil printing solder is a more robust and stable process then dispensing. The common defect for dispensing solder is missing dots due to clogged nozzles.
Please note registration is required, these pages are for DEK Customers only.
Visit the Singulation Process area
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