Instinctiv™ V9 2D Inspection option
V9 2D inspection Optimizes the cycle time and ensures quality of print.
2D inspection (2Di) ensures the quality of the print by monitoring the printing process. 2Di can determine when a stencil clean or paste dispense is required and if licensed, to warn for bridging, misalignment, stencil smear, stencil blockage and reduced paste volume.
2Di can be used to optimize the cycle time by eliminating unnecessary stencil cleaning and paste dispensing operations. To achieve this the system inspects various areas of the board and/or stencil (sites) to detect the following:
|  | Stencil Blockage - Solder paste remaining inside stencil apertures. |
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|  | Stencil Smear - solder paste on the underside of the stencil. |
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|  | Board: Paste Present - amount of the pad covered by solder paste, as a % of the aperture size |
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|  | Board: Alignment - accuracy of paste positioning compared to the learnt site image. |
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|  | Board: Bridging - distance between adjacent deposits of paste or between pad and next pad. |
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|  | Board & Stencil: Volume - 2Di combines the paste on pad and blockage results, using a propriety formula calculates the predicted paste volume. This is only available while the inspection is set to advanced for both board and stencil. |
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The 2Di system uses pre programmed inspection sites. At the start of the batch the inspection system takes images of the clean stencil and pre-pasted board, at post print inspection the control limits applied to the sites are used to maintain the print quality and flag the appropriate alarm when required.
Camera options (Green v Gold)
The DEK Gold camera system gives an inspection field of view three times larger than that available with the Green camera system. This speeds up the inspection process by the reduction in the number of sites the system is required to visit to accomplish the inspection task.
Green (shown at full zoom level)
Gold (shown at full zoom level)
The Instinctiv™ V9 2D Inspection option offers the following enhancements.
Below shows the 2Di status monitoring page with inspection sites colour coded in pass, warning and fail colours (green, amber and red respectively).
Simple and fast set up in V9 style….
… with intuitive prompts and On Board guidance, designed to meet Operator requirements
Clear graphical reporting of paste on pad, bridging, blockage, smear, predicted volume and alignment with full yield enhancing control of post print analysis
Powerful SPC data tool for analysis of process behaviour to identify trends and provide real time process control
Inspection Licenses
The following types of inspection are available:
Basic
Advanced
Summary Specification
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Inspection
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Specification
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Maximum Number of Sites
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1000 sites
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Maximum Site Size
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4 mm by 6.5mm (Green/graphite Camera) / 10mm x 7.5mm (Gold Camera)
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Automatic Learn
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Single Site
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Rows
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Columns
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QFP
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BGA
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BGA Frame
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Stencil Inspection
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Accuracy (Within)
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Repeatability
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Aperture Blockage
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±6%
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±5%
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Stencil Smear
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±0.1mm²
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±0.05mm²
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Board Inspection
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Paste on Pad
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±5%
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±5%
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Bridging
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±0.05mm
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±0.02mm
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Paste Alignment
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±0.02mm
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±0.02mm
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Predictions
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Paste Volume
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±6%
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±5%
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Programmable Inspection Rate
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All sites inspected every cycle
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Selected sites inspected every cycle
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Inspection of sites every n cycles
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General Inspection Parameters
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Individual site limits
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Individual site naming option
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Each inspection site can be given a unique name
to make it traceable
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Programmable warning and alarm levels for individual
sites
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Programmable Action on Alarm
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Reprint after low paste detection
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Under screen clean after blockage or smear detection
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