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 DEK Automated Under Stencil Cleaning Products
An equally important variable in the wet underside stencil cleaning equation is the use of effective chemicals and solvents. To meet the increasing demand from its customers to provide cleaning solutions that address effective cleaning requirements and escalating concerns regarding safety and environmental issues, DEK provides its new products for use in automated stencil printing cleaning applications.
DEK-PRO EF Under Stencil Cleaning Solution
DEK’s powerful new cleaner for use during wet, underside stencil cleaning processes in SMT printers was specifically developed to replace hazardous and health threatening IPA and other low-flash point cleaning solvents.
Special Advantages
· Removes solder paste without harming the printing capabilities of the paste.
· Improves Manufacturing Process Control.
· HMIS (0,0,0) and low odour equates to excellent Health & Safety features.
· Low VOC Content helps protect the environment.
· In most applications the usage rate can be reduced up to 50% over IPA and other low-flash point solvents, especially when used with DEK’s Under Stencil Clean Rolls.
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DEK-PRO Under Stencil Cleaning Solvent
DEK’s powerful new solvent-based cleaner for use during wet, underside stencil cleaning processes in SMT printers was specifically developed to replace hazardous and health threatening IPA and other low-flash point cleaning solvents.
Special Advantages
· Removes solder paste without harming the printing capabilities of the paste.
· The high-flash point and low odour addresses Health & Safety concerns.
· The product exhibits excellent drying characteristics and there are no storage restrictions due to flammability.
· In most applications the usage rate can be reduced up to 50% over IPA and other low-flash point solvents, especially when used with DEK’s Under Stencil Clean Rolls.
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