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High Performance Under Stencil Cleaning Rolls
To maximize pre-placement yield, it is imperative to perform regular, effective stencil cleaning. As high-density applications and ultra fine pitch assemblies become the norm, cleaning performance beyond conventional paper-based cleaning materials is required.
DEK offers two excellent under Stencil cleaning roll solutions to meet the stringent requirements of today’s electronics manufacturers: Sontara® CleanMaster Rolls and DEK SMT Rolls.
Sontara® CleanMaster Roll
DEK has partnered with international chemical specialist, DuPont, to produce cleaning rolls featuring advanced Sontara® CleanMaster fabric. This material features an advanced structure of outstanding strength and absorbency with reduced lint, which results in increased stencil cleaning efficiency.
Because of Sontara’s excellent absorbent qualities, even small quantities of paste, adhesive or solvents are removed from the stencil underside, preventing bridging and allowing downstream processes to be completed efficiently.
Sontara® Benefits and Specifications
Sontara® CleanMaster Roll Benefits:
High performance USC medium
Developed by DuPont for SMT applications
Enhanced cleaning raises yield and throughput
High tear resistance raises MTBF and reduces operator intervention
Ideal for fine-pitch SMT manufacturing and advanced screen printing applications
Sontara® CleanMaster Roll Specifications:
Standard widths are available. Compatible with all DEK inline printers and alternative manufacturer’s printing machines as well.
Fabric Technical data
| Property | | Value | Unit | Test Method |
| Composition | Polyester | 46 | % | |
| | Woodpulp | 54 | % | |
| Basic Weight | | 51 | g/m2 | ASTM D3776 |
| Thickness | | 0.28 | mm | ASTM D1777 |
| Intrinsic water absorption | | 4.56 | ml/g | IES-RP-CC-084.2 |
| Extrinsic water absorption | | 244 | ml/m2 | |
| Intrinsic absorption rate | | 34 | ml/g/s | |
| Extrinsic absorption rate | | 1807 | m1/m2/s | |
| Grab tensile | MD | 133 | N | ASTM D5034 |
| Breaking strength (dry) | XD | 67 | N | |
| Grab tensile | MD | 112 | N | |
| Breaking Strength (wet) | XD | 57 | N | |
Ordering Information
| Part Number | Description |
| 115660 | CleanMaster, USC Fabric, W-515mm,
Use with any DEK Cleaner |
| 115662 | CleanMaster, USC Fabric, W-400mm,
Use with any DEK Cleaner |
| 115664 | CleanMaster, USC Fabric, W-300mm,
Use with any DEK Cleaner |
DEK SMT Roll
The DEK SMT Roll is a high performance under stencil cleaning roll that offers excellent cost-effective cleaning performance and has been developed to optimize the cleaning performance of the automated under Stencil cleaning systems for the following: DEK screen printers, most MPM, EKRA, Fuji, Panasonic, Sanyo and SMTech/Quad screen printers.
The roll material is a unique spun-woven polyester blend that provides good absorbency, low-lint and exceptionally strong wet tensel strength. The fabric’s unique construction expedites the drying time for most solvents and cleaning chemicals and, when dry, ensures a completely dry stencil for the next print cycle.
DEK SMT Roll Benefits and Specifications
DEK SMT Roll Benefits:
Cost-effective cleaning performance
Unique material expedites drying time
Available for a variety of screen printing systems
Extremely low-lint
DEK SMT Roll Specifications:
| Property | | Value | Unit | Test Method |
| Composition | Polyester | 40 | % |  |
| | Cellulose | 60 | % |  |
| Basic Weight |  | 50 | g/m2 | ASTM D3776 |
| Thickness |  | 0.25 | mm | ASTM D1777 |
| Intrinsic water absorption |  | 4.5 | ml/g | IES-RP-CC-084.2 |
| Extrinsic water absorption |  | 225 | ml/m2 |  |
| Intrinsic absorption rate |  | 30 | ml/g/s |  |
| Extrinsic absorption rate |  | 1500 | m1/m2/s |  |
| Tensile strength (dry) | MD | 120 | N | ASTM D5034 |
| Tensile strength (dry) | CD | 90 | N |  |
| Strain(dry) | MD | 31 | % |  |
| Strain(dry) | CD | 78 | % |  |
| Tensile strength (wet) | MD | 105 | N |  |
| Tensile strength (wet) | CD | 78 | N |  |
| Tear Strength (dry) |  | 50 | N/cm2 |  |
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