This breakthrough stencil technology provides a fast, convenient and cost-effective alternative to traditional adhesive dispensing. Based on an acrylic material that can be easily and accurately machined, VectorGuard PumpPrint stencils are ideal for the deposition of a wide range of adhesive patterns.

VectorGuard® PumpPrint® Stencils cover a wide range of applications ranging from SMT adhesive processes to silver epoxy die attach, high volume deposition of solder past and extrusive reflow. Enabling surface mass imaging of any multiple combination of deposit heights even on pre-populated surfaces in one single print stoke cycle, PumpPrinting meets diverse manufacturing challenges while reducing manufacturing cost and process cycle time.

VectorGuard PumpPrint stencils are machined with a series of circular apertures or slot configurations acting like perfectly positioned dispensing nozzles. This allows deposits of different heights and patterns in almost any shape and size, while the stencil material can also be pocket machined to fit over pre-placed components. Plus, with the ability thousands of multi-height glue dots in one go for fast production line rates, the technique is performed using a standard mass imaging platform to maximise existing capital investment.


VectorGuard® PumpPrint® Specifications

Standard thickness of 3.0mm (other thicknesses on request)

Deposit heights from 75µm to >2mm

Stencils generated using Gerber, HPGL, CAD or scanned-board data

Available in standard and VectorGuard® formats

Lightweight, solvent resistant stencils

Compatible with component sizes from 0603 to large QFPs

Underside routing allows stencil to clear components, cut and clinched leads, paste and solder mask.

Three day turnaround on new stencil orders.