|
 |
Welcome to the DEK Stencils area.
As today’s industry evolves, the pressure is on modern manufacturers to rise to the challenges set by the new generation. With increasingly demanding applications requiring an enhanced print performance, DEK is committed to consistently raising the bar for the provision of enabling technologies. A comprehensive range of stencil technologies is a good example of how it is achieving this industry-wide.
Since 1990, DEK has been a leading supplier and developer of high accuracy SMT stencils for the PCB assembly industry. The continued acquisition and development of new technologies, coupled with expansion into new markets, has ensured that as the industry expands and diversifies, DEK remains equipped to drive its growth.
Stencil solutions for every customer requirement
DEK delivers a wide range of leading-edge stencil technologies to customers around the world. To find out more about the most appropriate DEK stencil technology for your manufacturing operations, please choose a product type from the list below:
 | |
| |
|  VectorGuard® Gold
Building on the innovative performance delivered by VectorGuard® Silver, VectorGuard® Gold takes this one step further for manufacturers requiring exceptional aperture wall definition. With all the printability and paste release advantages associated with Nickel, DEK’s electroformed stencil technology is smoother, a direct result of its renowned additive process.
Read More ... |
| | |
|  VectorGuard® Silver
With the lead-free deadline and changing paste properties just around the corner, reliable stencil technology is now more important than ever. DEK’s extensive research into this area has proven that pure nickel stencils are optimised to achieve the highest levels of paste volume repeatability. Building on the low coefficient of friction in relation to nickel, VectorGuard® Silver nickel laser-cut stencils will deliver optimal process efficiency for your manufacturing environment.
Read More ... |
| | |
|  VectorGuard® Blue
DEK VectorGuard™ stencils enhance the Vector frame concept to achieve even easier handling, management, storage and changeover. Frame mounted foils are easier to store and manage than standard, permanently-mounted stencils. Foils can be kept in a convenient and space-efficient hanging filing system. There is no need to return each frame to the stencil supplier for credit and recycling. And the foil is automatically tensioned every time, immediately before use.
Read More ... |
| | |
|  VectorGuard® PumpPrint®
PumpPrint™ Stencils cover a wide range of applications ranging from the now industrial standard of SMT adhesive application to silver epoxy die attach, high volume depositions of solder past and extrusive reflow. PumpPrint stencils allow surface mass image printing of any multiple combination of deposit heights even on pre-populated surfaces in one single print stoke cycle. PumpPrinting opens up a wide range of manufacturing process alternatives with potential for reducing manufacturing cost along with process cycle time reductions.
Read More ... |
| | |
|  PumpPrint®
PumpPrint® technologies enable high throughput adhesive deposition using a screen printing platform. Careful selection of stencil material, and informed study of the design of apertures and other stencil features, enables a wide range of adhesive patterns to be successfully deposited using a standard screen printer. New techniques, including ProFlow® DirEKt Imaging, enhance the speed, repeatability and flexibility of PumpPrint® to far outstrip the capabilities of current adhesive dispensers.
Read More ... |
| | |
|  Platinum - High Precision Micro Engineered Stencil Technology
DEK Platinum represents a breakthrough in the critical field of stencil technologies, delivering exceptional and repeatable precision for a diverse range of demanding applications. Founded on a novel MEMS-based fabrication process, high accuracy Platinum stencils are capable of achieving the ultra-fine geometries now standard in the majority of today’s interconnection technologies.
Read More ... |
| | |
|  Electroformed
Electroforming delivers the ultimate control over stencil thickness and uniformity, delivering outstanding paste volume consistency for fine pitch applications. Excellent aperture characteristics also assure reliable paste release.
Read More ... |
| | |
|  Laser Cut
Optimum Stencil Design plays a key role in ensuring outstanding productivity from your process. Control of the aperture characteristics, stencil thickness and accurate fiducial generation are directly related to the volume, alignment and positioning of paste deposited during printing. Correct stencil design, coupled with quality manufacture, makes a significant contribution to end of line yield.
Read More ... |
| | |
|  Additive
Additive stencil technology from DEK enables variable deposit thickness to be achieved in a single pass, using an enclosed print head technique such as ProFlow® DirEKt Imaging.
Read More ... |
| | |
| |
| |
| |
| |
| |
|
|