 |
| Wafer Bumping
Stencil printing delivers significant performance and cost advantages in wafer bumping for advanced semi-conductor packaging, compared with traditional approaches. New levels of throughput, accuracy and repeatability are founded on DEK's patented ProFlow® DirEKt Imaging Technology.
|
| DirEKt Ball Placement™
DirEKt Ball Placement™ uses DEK’s patented ProFlow® DirEKt Imaging technology to bring significant advantages to semiconductor packaging techniques. Now component manufacturers can benefit from gentle handling and accurate solder ball placement, enabled by ProFlow®, to achieve first pass yield consistently above 99%. |
| Wafer Handling Station
The DEK wafer handling station is a fully automated handling solution, integrated with DEK’s wafer level mass imaging processes. It is developed in conjunction with Adept Semiconductor Equipment Division; a specialist partner with impeccable credentials. |
| SnapSHOT®
Gore's snapSHOT® shield, composed of a metallized, high temperature, high performance plastic material, can be thermoformed to accommodate intricately shaped designs or multi-cavity configurations. The innovative material weighs 80 to 90 percent less than a metal can of similar size. The electrical insulating properties of the base material allow a lower profile shield design that virtually eliminates the gap between components and shield and reduces the required minimum component-to-component spacing by 25 to 50 percent. |
| SinguLign™
DEK’s SinguLign™ enables the high accuracy mass imaging of multiple materials such as solder paste, solder spheres, flux and adhesive onto singulated substrates or components directly from the carrier, allowing the accurate processing of known good parts down to 20 mm in size.
|
| DirEKt Coat™
DEK has developed a next-generation equipment and tooling package that enables the coating of wafers with ultra-thin die attach materials down to 25 microns in thickness. The solution, called DirEKt Coat™, consists of a Micron-class Galaxy mass imaging system, a DEK engineered ultra-flat pallet, a die attach stencil or screen and a specially designed squeegee.
|
| Alignment Solutions for Advanced Packaging
The merchant semiconductor packaging market has grown dramatically throughout the 21st century, as the world’s chip producers collaborate with outside specialists to minimize time to market and design costs. Proving the robust health of this market, the global market leader, Amkor, posted record sales for the first quarter of 2006, up 55% on the same period in 2005. The market is growing, as are the number of businesses serving it, as packaging performance now influences many advanced designs.
|
| Commercial High Volume Fuel Cell Production
The world is almost ready for fuel cell technology. Scarcely a person on the planet is not concerned about environmental damage from burning fossil fuels. In addition, government levies and upward pressure on exchange prices for oil and gas are bolstering the economic argument for generators, vehicles, CHP schemes and more that leverage the renewable nature and benign emissions of the fuel cell.
|
| Encapsulant
K&S and DEK are developing a low-cost, high-volume alternative to injection molding and dispensing processes, by combining their expertise in liquid encapsulant compounds and high accuracy mass imaging technologies. StenSEAL is a single component, silica-filled, liquid encapsulant, formulated to provide a smooth-surface, void-free, molded package appearance when applied using DEK’s patented ProFlow® DirEKt Imaging.
|
| Virtual Panel Tooling (VPT)
Virtual Panel Tooling (VPT) aligns substrates independently and simultaneously ready for imaging in a single cycle. This concept provides high throughput comparable to processing panelized substrates, but with accuracy comparable to individually aligning each substrate before processing.
|