High Precision Micro Engineered Stencil Technology

DEK Platinum represents a breakthrough in the critical field of stencil technologies, delivering exceptional and repeatable precision for a diverse range of demanding applications. Founded on a novel MEMS-based fabrication process, high accuracy Platinum stencils are capable of achieving the ultra-fine geometries now standard in the majority of today’s interconnection technologies. In fact, Platinum overcomes the limitations of conventional stencil systems to meet every ultra-fine pitch printing requirement.


DEK Platinum’s superior print performance means that the technology is ideally suited to a range of demanding manufacturing applications including BGAs, direct chip attach, flip chip and wafer level packaging. Facilitating apertures of 20µm on 50µm pitch, Platinum stencils offer DEK customers exceptionally smooth sidewalls for highly efficient paste transfer - even when dealing with square apertures. Supporting an advanced throughput level and more efficient print processes, Platinum is a pioneering stencil solution to meet the challenges of the next generation.



Platinum Specifications

Finest pitch - 50µm

Smallest apertures - 20µm

Precision aperture accuracy <3µm

Excellent thickness uniformity across design area – 2%Suitable for applications including direct chip attach, flip chip on board, ball grid array, wafer level packaging and ball placement singulation discs


Platinum Benefits

Controllable surface roughness

Ultra-smooth sidewalls

High yield due to exceptional paste release characteristics

Smaller web spacing enables larger deposit volume over single footprint

Low internal stress and high hardness prevents stencil deformation

Eliminates lip around apertures to avoid paste bleed out

Manufactured to fit most screen printing platforms worldwide