Via-in-pad technology is becoming a more essential strategy used to support finer pitch devices. These components present today's pcb designs with challenges to increase routing channels, reduce layer count and try to stay within conventional lamination standards.






Previous Press Releases - ProFlow® Via Fill plugs the gap

Product Information - An Introduction to Via-Fill process



Visit the Via Fill features page and find out Information on the PumpPrint technique here

Visit the Via Fill benefits page and find out about the Advantages of PumpPrint over traditional dispensing here

Visit and find out about the Via Fill Implementation plan for making PumpPrint a reality here


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