Wafer Bumping


Precision mass imaging at wafer level opens up new commercial opportunities in advanced semiconductor packaging. To achieve truly flexible, cost-effective wafer bumping, you need to leverage DEK's acknowledged leadership in high accuracy mass imaging processes for electronic assembly.


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DEK can configure a complete wafer bumping solution, including wafer handling, mass imaging, and reflow of imaged wafers. We can commission the entire line, right through to optimising the reflow profile, to achieve astonishingly high production yields. DEK's state of the art process capabilities and stencil technologies make mass imaging the technique of choice for future wafer bumping applications. The ProFlow® imaging head is a key enabling technology, delivering highly repeatable stencil aperture filling and excellent gasketing between the stencil and wafer for outstanding paste volume transfer and uniformity. ProFlow® also allows precise control of print pressure, which further supports high yield at production throughput. Savings in paste wastage deliver further cost reductions in a process that is already significantly less expensive than first generation approaches to wafer bumping.



Significant saving in capital investment for advanced packaging

High quality, commercial wafer bumping

Produce CSP variants, flip-chip, SiP in production volumes

Proven accuracy and repeatability

Simple process flow: print; reflow; clean

DEK ready to install turn-key, wafer-to-reflow process

Wafer handling and stencil production solutions fully developed

Wide range of alloys and conductive epoxies

Advanced DEK technologies compatible with clean room environments

Small equipment footprint



The mass imaging process, including DEK's patented ProFlow® technology, is supported by our precision stencil design and production capabilities, and the Adept wafer handling systems developed in conjunction with DEK. DEK's stencil production capabilities include electro-form and chemical-etch processes, as well as precision laser cutting. Our global network of manufacturing facilities delivers rapid turnaround on stencil orders for all processes.You will find full details on the wafer handler in the datasheet Comprehensive, Integrated Wafer Handling.